CMOS Process: Unit, module, and integrated process services based on 180nm CMOS technology
MEMS Process: Unit, module, and integrated process services for various sensors and μ-OLEDoS
Overview of 8-inch Transparent Substrate Process Service
CMOS & MEMS process services based on transparent substrates such as Quartz, glass, LiNbO3
Overview of Other Process Services
6-inch, 4-inch specimen: Process services using Zig
Overview of Expanded and Applied Process Services
Support for system semiconductor research and development, product development, and prototype production based on the above basic services
For example: MEMS sensors on CMOS ROIC (Read-out IC), Micro displays on CMOS ROIC, Next-generation memory on CMOS ROIC, etc.
Overview of Component, Part, and Equipment Testbed
Construction of 8-inch and 12-inch component, part, and equipment testbeds for semiconductor material, part, and equipment development, and provision of test verification and verification services to domestic industry-academic researchers.