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National Nanofab Center

national nanofab center

180nm Technology

Field Semiconductor Integrated Processing Platform
  • Technology Name

    180nm CMOS Technology

  • Overview

    180nm CMOS Batch Processing Platform

  • Technical Features

    Establishment of a batch processing platform using 180nm CMOS technology and support for MPW production through collaboration with industry, academia, and research institutes, contributing to system semiconductor companies and next-generation semiconductor R&D

  • Technical Advantages

    • Stabilization of 180nm CMOS FEOL module process
      • TEG design
      • Optimization of STI (Shallow Trench Isolation) & Well modules
      • Optimization of Gate (Dual Gox, Poly-Si) modules
      • Optimization of LDD & SD Junction modules
      • Optimization of Silicide (Co Salicide) modules
    • Establishment of 180nm CMOS batch processing platform
      • Development of a mix-and-match key placement strategy for aligning between lithography tools
      • Setup of Auto PCM measurement for electrical characteristic evaluation
      • Securing the operation characteristics of NMOS / PMOS transistors
    • Establishment of 180nm CMOS batch processing platform PDK
  • Application of
    Technology

    • Establishment of an open MPW service based on feedback from industry, academia, and research institutes, contributing to the flexible technology cooperation model among future fabless-foundry
    • Serving as a testbed for early technology commercialization of companies by presenting a technology library based on future demand type specialized materials/devices/processes.
    • Contributing to the shortening of commercialization period and cost reduction of companies by supporting technology review and design verification at all stages before product manufacturing based on the platform technology library and systematic process design kit (PDK)
  • Scope of Service and
    Technology Level

    • Open MPW service based on 200mm silicon 180nm CMOS is available
    • Poly / Metal: 1 Poly / 6 Metal
    • Well : P-sub, Retrograded Twin Well
    • Isolation : STI (Shallow Trench Isolation)
    • Gate Oxide : NO (Nitirded Oxide)
    • Gate Electrode : Dual Gate Oxide, Poly-Si
    • Silicide : Co-Salicide
    • PMD : PE Nitride / BPSG / PETEOS
    • Contact : W-wiring
    • Metallization : Ti / Al / Ti / TiN
    • IMD : HDP / PE TEOS
    • Planarization : Oxide CMP & W CMP
    • Passivation : HDP / SiN
  • Contact Information

    Person in charge Dongju Seo
    Contact 042-366-1612
  • Related Images

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    MPW 구축단계 (2020 ~ 2021)
    • Value Chain :제품 설계(Design) Design House : PDK 구축
    • Value Chain : 위탁 생산(Foundry) NNFC : MPW Platform 구축
    • Value Chain : 조립, 검사(Package & Test) PKG : 소량다품종 환경 구축
    MPW 서비스 단계 (2022 ~ 2024)

    180nm 기반 MPW 서비스로 한국나노기술원, 나노종합기술원에서 서비스합니다.

    • Fab-iite / Fabless 업체
      • 공공파운드리 역할 정립으로 시스템반도체 생태계 활성화
      • 국외 기술 의존도↓, 국내 기술 자립도↑
    • 국내 학교 · 연구소
      • 시스템반도체 설계인력 고도화 지원
      • 원천기술 제품화 개발 지원