Infrastructure
Facilities and Equipment
- Research Building: 9 floors above ground/1 floor underground
- FAB Building: 1st and 2nd floors
- Facility Support Building: 4 floors above ground/1 floor underground
- Service Areas: Nano-process, Nano-sensor and Structural Materials Nano-bio, Analysis and Characterization Evaluation
Facility List
Equipment List
- CMOS technology, MEMS technology, SI structures, 3D packaging semiconductor materials/materials evaluation, nano/micro sensors, etc.
- Composite sensors (temperature, flow rate, wind speed, etc.), IoT sensors, 2D/3D structure patterning, nano-material synthesis/assembly/analysis, nano-discovery platform
- Next-generation nano-biochips, nano-diagnosis, smart healthcare, smart medicine, etc.
- Atomic scale microstructure/composition analysis, defect analysis, surface analysis, 2D dopant profile measurement technology, etc.
Facility Status
Area
1 floor underground, 9 floors above ground
(16,585㎡)
2F
(4,989㎡)
1 floor underground, 4 floors above ground
(4,620㎡)
Fab (1st floor) (2,500㎡)
- 12-inch Testbed: 248㎡
- 8-inch Testbed: 2,231㎡
- 12-inch: ArF Immersion Scanner+Track, Dry Etcher, CD-SEM, PR Stripper
- 8-inch: ArF Dry Scanner+ Track, KrF Scanner, I-line Stepper, etc.
Fab (2nd floor) (2,500㎡)
- 12-inch Testbed: 992㎡
- MEMS Sensor (8-inch): 992㎡
- 12-inch: Multi-Chamber PECVD, Oxidation Furnace, LPCVD Furnace Single Wafer Cleaner, etc.
- MEMS Sensor (8-inch): Mask Aligner, Deep Silicon Etcher, Wafer Bonder, etc.
Infrastructure Status - Fab Layout
1st floor cleanroom (2,500m2)
8-inch unit, 180nm batch process
2nd floor cleanroom (2,500m2)
12-inch unit process, bio/sensor device development
크게 왼쪽에 Litho, 중간 위 MEMS, FE-SEM, 중앙 아래 CMOS, Tour Line 오른쪽에 입구와 출구로 나누어져 있습니다. 아래는 해당 영역안에 있는 지점을 정리하였습니다.
CAB, THC, LVO10, SHF, LEL 10, WT, OPR1, OPR2, LCD10, LCD40 PR, ACT-8 LTS40, LOA10, SHF, LTK40, C-supply, Cot, Dev, MTM10, 현미경, Wet, ALT10, ALS10, ACD10, ADI10, AEO10, Sorter, APR10, I&H, Themmo, LDI10, PR BOx, Track, 1/f, LTS20, OPR, KrF Scanner(LTS30), LST20, LTK30, LST10, LTK30, Retide Strocker
WT, SHF, NNT20, NSP10, Con, CAB, DRT22, NPE10, 비상샤워기, NEV30, laser anneal, NWS22, NOX10, NLT10, NPL10, NNT10, NWS11, NPE20, NDE20, u/i, NPR10, EPR30, EME20, 현미경, MSM10, CONT, IGZO Sputter 설치 예정 위치, FOUP CLeaner, Slurry 공급, NCM20, EGP10, 세정, NSP20, EME30, NEV20, EOX20, MFP10, Controller, TSP20
ESE10, 현미경, WT, SHF
CAB, SHF, LTS, ERE10, EPR10, WT, EOX10, EME10, MTM40 CAB, TCW10, EDT30, TPE30, DRT21, RFgen, Tube Strocker, DRT32, TPE10, DAL20, TPE50, TCW20, NPE30, NPE40, MTM30, MTM20, DIM10, DRT11, TPE40, TSP10, Cont, DVG10, DLT10, DTE10, DNT10, DPL10, DOX10, DOX20, DOX30, DHT11, DWS11, DWS22, DWS33, 비상샤워기, Wet, AC, C, HF, 안전용, DCM20, DCM10, 신규 WET setup중, SPIKE RTP, DIM21, DNT30, DTE30, DPL30, DIM30, 보호 창구
A/L, SHSFT, WT, 진공포장기, CAB, AS
PC, E-, 칠러, NMF10, Control Rack, LCyer, NMC10, LCyer, dry, PC, 현미경, OVEN, 스핀, WT, NSC10, THC, Wet Bench, NTK20, Curing, WT, Spin Coater, Manual Coater, Wt, 현미, 셀프, Nano Imprint 23년 8월입고, BLG20, NCL30, BLG10, CAB, 시약, NWS3, WT, NCL20, ?, 케미칼보관, S/D, MPF20, WT, THC, NTK70, NTK60, 셀프, OVEN, CAB, 현미경, NWS40, NCL60, WT, NCL10, MTM60, 냉장고, 비상샤워, 보호, PW, 셀프, 보호
좌측 300MM 영역CAB, Wet CDS, ADO10, Wet CDS, ADN10, 셀프, WT, ADW10(L/D), ATP10, Reclaim(WET), ATM10, PECVD, CAB, 삼성 유휴 SPUTTER(refurb.대기)
좌측 BIO 영역BPG10, BIO VAC, BSC20, BIC10, BFL10, 셀프, Tube STK, Sorter, BWS20, BCS30, WT, 셀프, CAB, BET10
FAB 후 공정 영역WT, BLM10, expander, Femtolaser, AS, 셀프, 삼성유휴 8"PE CVD
중앙 영역셀프, WT, wet station, Dry Etcher(Piezo-electric), NSP30, 셀프, CAB, percvd, NLF20, BEV10, BWS10, NEP30(Cu), NEP30(NiCo), NCP20, CAB, 셀프, NEP20, MPF50, MFP30, EDT40
중앙 센서(IOT) 영역셀프, 1,2,3,4, 비상계단, 배전반, WT, CAB, BFB30, BFB30, LDI20, BFB10, NOX50, WT, NEV40, BFB20, CONT, 셀프, NLT20, NSP40(AIN SPT), BFB40, PWT10, EPR20, PHV10, 배반, MPF30, 업체(오킨스 wet), 업체, 보호창구, 비상샤워, 입주 기업(템파스), AS, smock room
우측 KAIST 교육용 팹300mm 장비, FAB 장비, 바이오 장비, 입주기업 장비, IOT 장비, 위쪽에 장비반입로, SHSFT