본문 바로가기
대메뉴 바로가기
National Nanofab Center
Ministry of Science and ICT
KAIST
EMS
KR
검색어
열림버튼
통합검색
검색어를 입력해주세요
검색
전체메뉴
전체메뉴
Service
Service
National Nanofab Center
Fab Service for overseas user
Processing service
Nano·Semiconductor Processing
Photo
Etch
Thin Film
Diffusion
In-line Measurements
Packaging
Simulation
Nanomaterials
Batch process
Analysis and Evaluation service
Introduction
Structural analysis
Surface/Composition analysis
Product analysis
Education service
Introduction
Training schedule
Equipment and contact
Photo
Etch
Thin Film
Diffusion
In-line Measurements
Packaging
Simulation
Structural analysis
Surface/Component analysis
Product analysis
Nanomaterials
Bioanalysis
Device analysis
Usage procedures and fees
Usage procedure
FAB access guide
Usage fee
Payment of usage fee
Platform technical support
Platform technical support
National Nanofab Center
Semiconductor integrated process platform
0.18㎛ Technology
0.13㎛ Technology
Intelligent semiconductor
Nano-Bio platform
Microfluidic device·chip
MEMS in vitro diagnostic biosensor
Healthcare device
USB (User Switchable Biosensor) packaging
Next-generation sensor manufacturing platform
Thick MEMS
Thin MEMS
WLP
Material development platform
Semiconductor materials
Solid-state battery
Advanced packaging materials
Nano semiconductor convergence device platform
Display
Quantum sensor
Silicon Photonics
Technical support procedures/methods
Information
Information
National Nanofab Center
PR Center
NNFC Movies
NNFC Brochure
About NNFC
About NNFC
National Nanofab Center
Greetings
Introduction
Overview
Infrastructure
History
Organization
Organization chart
Member
Directions
Service
Fab Service for overseas user
Processing service
Nano·Semiconductor Processing
Photo
Etch
Thin Film
Diffusion
In-line Measurements
Packaging
Simulation
Nanomaterials
Batch process
Analysis and Evaluation service
Introduction
Structural analysis
Surface/Composition analysis
Product analysis
Education service
Introduction
Training schedule
Equipment and contact
Photo
Etch
Thin Film
Diffusion
In-line Measurements
Packaging
Simulation
Structural analysis
Surface/Component analysis
Product analysis
Nanomaterials
Bioanalysis
Device analysis
Usage procedures and fees
Usage procedure
FAB access guide
Usage fee
Payment of usage fee
Platform technical support
Semiconductor integrated process platform
0.18㎛ Technology
0.13㎛ Technology
Intelligent semiconductor
Nano-Bio platform
Microfluidic device·chip
MEMS in vitro diagnostic biosensor
Healthcare device
USB (User Switchable Biosensor) packaging
Next-generation sensor manufacturing platform
Thick MEMS
Thin MEMS
WLP
Material development platform
Semiconductor materials
Solid-state battery
Advanced packaging materials
Nano semiconductor convergence device platform
Display
Quantum sensor
Silicon Photonics
Technical support procedures/methods
Information
PR Center
NNFC Movies
NNFC Brochure
About NNFC
Greetings
Introduction
Overview
Infrastructure
History
Organization
Organization chart
Member
Directions
닫기
national nanofab center
Service
HOME
Service
Service
Platform technical support
Information
About NNFC
Homepage Guide
Equipment and contact
Fab Service for overseas user
Processing service
Analysis and Evaluation service
Education service
Equipment and contact
Usage procedures and fees
Packaging
Photo
Etch
Thin Film
Diffusion
In-line Measurements
Packaging
Simulation
Structural analysis
Surface/Component analysis
Product analysis
Nanomaterials
Bioanalysis
Device analysis
SNS공유
닫기
페이스북
트위터
블로그
복사하기
프린트
Packaging
Home
Service
Equipment and contact
Packaging
SNS공유
닫기
페이스북
트위터
블로그
네이버 밴드
카카오스토리
카카오톡
복사하기
프린트
ALL
Photo
Etch
Thin Film
Diffusion
In-line Measurements
Packaging
Simulation
Structural analysis
Surface/Component analysis
Product analysis
Nanomaterials
Bioanalysis
Device analysis
게시물 검색
ALL
게시물 검색
Total
15
(Page
1
/2)
Packaging
Dielectric dry etcher
Maker
Oxford
Model
ICP 380
Id
EOX30
View
Packaging
8inch/12inch wafer level metal contamination analysis(VPD-ICPMS)
Maker
캠테크/(주)아이엠티
Model
Vaizer VPD ICPMS
Id
NIM10
View
Packaging
Vacuum Furnace
Maker
㈜P&Tech
Model
PF-D81
Id
NLT20
View
Packaging
Auto Metal Lift Off Machine
Maker
㈜이노맥스
Model
ASTRO2022
Id
NLF20
View
Packaging
Auto wet station
Maker
HIT
Model
HWS MWS
Id
NWS33
View
Packaging
Metal dry etcher
Maker
기가레인
Model
NEOGENⅡ-MAXIS200L
Id
NDE30
View
Packaging
Anodic bonder
Maker
EVG
Model
520IS
Id
BFB20
View
Packaging
Direct bonder
Maker
EVG
Model
520HE
Id
BFB10
View
Q
uick
Menu
Wafer
Specification
Information
Equipment
Manual
8-inch
Equipment
Usage Fee
12-inch
Equipment
Usage Fee
Analysis/Bio/
New Material
Equipment
Usage Fee
1
2