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National Nanofab Center

national nanofab center

Program details

Nano-specialist Training and Job Support Program

A program to train nano-specialists through on-site internships for unemployed graduates (or expected graduates) in the field of engineering.

Recruitment target: Unemployed graduates (including expected graduates) in the field of engineering

Selection method

  1. STEP.01 Recruitment announcement
  2. STEP.02 Document screening
    (1st round)
  3. STEP.03 Interview
    (2nd round)
  4. STEP.04 Announcement of successful candidates

Recruitment schedule and procedure

Recruitment schedule and procedure - Round, Announcement, Document/Interview Evaluation, Announcement of successful candidates, Start of training
Round Announcement Document/Interview Evaluation Announcement of successful candidates Start of training
1st round (25 people) Early January End of January Early February Mid-February
2nd round (25 people) End of March Mid-April Mid-April Early May
3rd round (25 people) End of May Mid-June End of June Early July
4th round (25 people) Early August Mid-August Early September Mid-September

The above schedule is subject to change based on the year 2024.

Training benefits

Full tuition waiver (theory/practical training)

Monthly training support: 500,000 KRW per month

Job competency enhancement workshop

Company recruitment briefing session

Award for excellent presentation on semiconductor device fabrication

Training stages

Basic(Stage 1)
Core foundation course(2 weeks)
Theory training
  • Semiconductor industry trends
  • Theory of 8 major semiconductor processes and devices
  • Theory of semiconductor post-processing and analysis
FAB process/analysis equipment rotation practical training
  • Group on-site training on semiconductor process equipment
  • Acquisition of basic knowledge of equipment by process
Intermediate(Stage 2)
Specialized course 1:1 mentoring course(5 weeks)
On-site practical training 1:1 mentoring
  • Understanding of FAB process duties and business process
  • Setting of project topic and practical training
Equipment advanced practical training through mentoring
  • Evaluation of equipment operation and key parameters
  • Acquisition of key management items by equipment
Advanced (specialized) practical training on equipment
  • Equipment disassembly and assembly
Advanced(Stage 3)
Full cycle on-site practical training course(7 weeks)
Semiconductor device fabrication practical training
  • Theory and discussion of semiconductor devices
  • Fab Process and process progress
  • Fabrication and measurement analysis of semiconductor MOS Cap. /MM Cap. devices
  • PT presentation and evaluation

The training curriculum may change depending on the operation of the training.

Semiconductor FAB practical training environment
Semiconductor FAB practical training environment related image
Lecture room environment
Lecture room environment related image
Equipment MAINT practical training environment
Equipment MAINT practical training environment related image
Library environment
Library environment related image
Company recruitment briefing session
Company recruitment briefing session related image
Semiconductor exhibition visit
Semiconductor exhibition visit related image
Interview competency enhancement workshop
Interview competency enhancement workshop related image
Individual company mock interview
Individual company mock interview related image
SAMSUNG 삼성전자
SK hynix
DB HiTek
ASML
Lam RESEARCH
HITACHI Inspire the Next
WONIK IPS
Amkor Technology
MiCo
Contact person

Heo Kang (042-366-1530), Ryu Hana (042-366-2094)

Training of specialized personnel for nano-infrastructure utilization
(practical training for silicon-based nano-device process and measurement analysis)

Recruitment target: Unemployed graduates (including expected graduates) in the field of engineering

Recruitment schedule and procedure

Recruitment schedule and procedure - Training, Training course, Number of trainees, Training period
Training Training course Number of trainees Training period
Foundation Nano-deviceㆍprocess 18 23. 5. 15. ~ 23. 5. 19.
Foundation Nano-analysis evaluation 15 23. 5. 22. ~ 23. 5. 26.
Specialization GOI manufacturing technology 15 23. 11. 20. ~ 23. 11. 24.
Specialization Equipment specialized training 10 23 1. 5. ~ 23. 1. 12.
Comprehensive practical Measurement analysis (summer) 25 23. 7. 3. ~ 23. 8. 25.
Comprehensive practical Device process (winter) 30 23. 12. 18. ~ 24. 2. 8.

Short-term course (basic/application): Selected from those who have completed the theoretical training of the Nano Technology Research Council

Long-term course (advanced): Selected by the institute itself (document screening + interview)

Training benefits

Full tuition waiver (theory/practical training)

Operation system focused on on-site practical training

Company recruitment briefing session

Job mentoring by professional committee

Award for excellent trainees (10 people/year) with certificate of commendation (Minister's Award) and gifts

Accommodation fee (within a certain limit) support

Lunch provided

Training course

Course Category Training
content
을 기준으로 각 교육과정을 설명합니다.
Level-based training course
Course
Foundation
Category
Nano-device · process
Training content
  • 5 days / 1 session
  • 18 people
  • Strengthening practical training centered on the use of process equipment linked to the nano-device process theory training course
Category
Nano-analysis evaluation
Training content
  • 5 days / 1 session
  • 15 people
  • Strengthening practical training centered on the use of analysis equipment linked to the nano-analysis evaluation theory training course
Increased practical training time
Course
Specialization
Category
GOI manufacturing technology
Training content
  • 5 days / 1 session
  • 15 people
  • GOI device structure fabrication and characteristic interpretation capability strengthening practical training
Category
Equipment specialized training
Training content
  • 1 day / 3 sessions
  • 10 people
  • Advanced training on research equipment centered on the demand of graduate students in the field of engineering to enhance research and development capabilities
Job creation
Course
Comprehensive practical
Category
Measurement analysis (summer)
Training content
  • 8 weeks / 1 session
  • 25 people
  • Strengthening practical skills in semiconductor measurement and analysis with a focus on employment linkage with nano-convergence companies
Category
Device process (winter)
Training content
  • 8 weeks / 1 session
  • 30 people
  • Strengthening job capabilities in semiconductor process and device fabrication with a focus on employment linkage with advanced industries

87.5% of the graduates in '21 have completed employment

Temporary reduction operation in 2024
Temporary reduction operation in 2024 - 2024 training plan, Implementation content, Number of trainees, Training schedule, Implementation schedule(1,2,3,4,5,6,7,8,9,10,11,12)
2024 training plan
Implementation content Number of trainees Training schedule Implementation schedule
1 2 3 4 5 6 7 8 9 10 11 12
Nano device process practical training 15 people 2 months(07.01 ~ 08.24) Have training Have training

The schedule may change depending on the status of the institution in the future.

Contact person

Baek Jong-hoon (042-366-2091), Yu Ji-young (042-366-2096)

Specialized High School Nano-Convergence Technology Education (Job Creation)

On-site customized education for semiconductor duties (Maintenance, Operator) targeting 3rd year students in specialized high schools in Daejeon Metropolitan City

Recruitment target: 3rd year students in specialized high schools in Daejeon Metropolitan City

Recruitment schedule and quota: (planned) April~May, within 40 people

Training schedule: (planned) September ~ December

Training content

Training curriculum (over 450 hours)
  1. Theory training(3 weeks)
    Major theory
    • Basic terms of nanotechnology
    • Basics of nano-semiconductors
    • Theory of semiconductor process
    • Theory of package technology
    • Industry-specific courses
    Liberal arts theory
    • Ethics education
    • Cultivation education
  2. Basic practical training(3 weeks)
    • Group equipment process experience and learning of equipment roles
    • 8 field rotation practical training (photolithography, etching, diffusion, thin film, characteristic analysis, new materials, bio, equipment disassembly practical training)
  3. Maintenance practical training(1 weeks)
    • Semiconductor chamber disassembly, assembly
    • Recipe Tunning
    • Understanding the function of major semiconductor parts
    • Equipment Trouble-shooting
    • Equipment parts fabrication practical training
  4. Advanced practical training(2 months)
    • 1:1 mentoring system
    • Learning and evaluation of equipment operation capabilities
  5. Industry on-site practical training
    • Package industry on-site practical training
    • Experience of the entire semiconductor process
Training site photos
Semiconductor theory class
Semiconductor theory class related image
Basic practical training
Basic practical training related image
Advanced practical training
Advanced practical training related image
Topic presentation
Topic presentation related image
Equipment MAINT practical training
Equipment MAINT practical training related image
Company on-site experience
Company on-site experience related image
Trainee evaluation system

Training benefits

Full tuition waiver (theory/practical training)

Monthly training support of 250,000 KRW, lunch provided

Semiconductor company recruitment briefing session and semiconductor exhibition attendance

Award for excellent trainees: Minister of Trade, Industry and Energy Award, Director of National Nanofab Center Award

Selection of excellent/improved trainees every month: Gift worth 50,000 KRW

Main employment destinations ('23 employment rate 94%)
SAMSUNG ELECTRONICS
DB HiTek
Amkor Technology
STATSChipPAC
onsemi
Contact person

Lee Kwang-chul (042-366-2095), Lee Yoon-ji (042-366-2092)

Open Equipment Training

Open Equipment Training Overview

"Equipment Training" is conducted for users who want to directly use the shared equipment of the institute in accordance with the "Guidelines for Open Use and Direct Use Management of Owned Equipment (2021.03.18.)" established to expand the use of Nanofab facilities and shared equipment.

Recruitment target: Employees, students, researchers

Application period: Beginning of each month

Application method: Moaform application

Training equipment and training quota

Training equipment and training quota - Training content, Training hours, Training fee (KRW), Training quota, Minimum number of people, Researcher in charge, Remarks
Training content Training hours Training fee (KRW) Training quota Minimum number of people Researcher in charge Remarks
PR Stripper 13:30~16:30 300,000 3 2 Researcher Jo Hee-jae
Furnace 13:30~16:30 300,000 3 2 Senior Hwang Hae-chul
Blade Dicer 13:30~16:30 200,000 3 1 Researcher Kim Su-hyun
2D Profiler 13:30~16:30 200,000 3 1 Senior Son Woo-sik
FE-SEM 13:30~16:30 200,000 3 1 Manager Hyun Moon-seop
Back-Grinder 13:30~16:30 200,000 3 1 Senior Kim Tae-hyun
Paticle Size Analyzer 13:30~14:30 Free 5 1 Senior Lee Yong-hee * Characteristics of this equipment
  • Powder particle size measurement is not possible, solution dispersion state measurement is possible
  • Measurement of nano-particle size less than micrometer is possible