본문 바로가기 대메뉴 바로가기

National Nanofab Center

national nanofab center

Infrastructure

Facilities and Equipment

Facilities
Site: 5,242㎡, Building: 26,433㎡
  • Research Building: 9 floors above ground/1 floor underground
  • FAB Building: 1st and 2nd floors
  • Facility Support Building: 4 floors above ground/1 floor underground
Equipment
Total of 412 units including ArF Immersion/Dry Scanner, Track
  • Service Areas: Nano-process, Nano-sensor and Structural Materials Nano-bio, Analysis and Characterization Evaluation

Facility List

Research Building related image
Research Building
FAB Building related image
FAB Building
Facility Support Building related image
Facility Support Building

Equipment List

Nano-process related image
Nano-process
  • CMOS technology, MEMS technology, SI structures, 3D packaging semiconductor materials/materials evaluation, nano/micro sensors, etc.
Nano-sensor and Structural Materials related image
Nano-sensor and Structural Materials
  • Composite sensors (temperature, flow rate, wind speed, etc.), IoT sensors, 2D/3D structure patterning, nano-material synthesis/assembly/analysis, nano-discovery platform
Nano-bio related image
Nano-bio
  • Next-generation nano-biochips, nano-diagnosis, smart healthcare, smart medicine, etc.
Analysis and Characterization Evaluation related image
Analysis and Characterization Evaluation
  • Atomic scale microstructure/composition analysis, defect analysis, surface analysis, 2D dopant profile measurement technology, etc.

Facility Status

Area

Research Building

1 floor underground, 9 floors above ground
(16,585㎡)

FAB Building

2F
(4,989㎡)

Central Facility Building

1 floor underground, 4 floors above ground
(4,620㎡)

Fab (1st floor) (2,500㎡)

Area
  • 12-inch Testbed: 248㎡
  • 8-inch Testbed: 2,231㎡
Equipment
  • 12-inch: ArF Immersion Scanner+Track, Dry Etcher, CD-SEM, PR Stripper
  • 8-inch: ArF Dry Scanner+ Track, KrF Scanner, I-line Stepper, etc.

Fab (2nd floor) (2,500㎡)

Area
  • 12-inch Testbed: 992㎡
  • MEMS Sensor (8-inch): 992㎡
Equipment
  • 12-inch: Multi-Chamber PECVD, Oxidation Furnace, LPCVD Furnace Single Wafer Cleaner, etc.
  • MEMS Sensor (8-inch): Mask Aligner, Deep Silicon Etcher, Wafer Bonder, etc.
NNFC's Facility related image
NNFC's Facility
NNFC's Equipment related image
NNFC's Equipment

Infrastructure Status - Fab Layout

1st floor cleanroom (2,500m2)
8-inch unit, 180nm batch process

2nd floor cleanroom (2,500m2)
12-inch unit process, bio/sensor device development

1F FAB Layout(Aug. 2023) image

크게 왼쪽에 Litho, 중간 위 MEMS, FE-SEM, 중앙 아래 CMOS, Tour Line 오른쪽에 입구와 출구로 나누어져 있습니다. 아래는 해당 영역안에 있는 지점을 정리하였습니다.

Litho

CAB, THC, LVO10, SHF, LEL 10, WT, OPR1, OPR2, LCD10, LCD40 PR, ACT-8 LTS40, LOA10, SHF, LTK40, C-supply, Cot, Dev, MTM10, 현미경, Wet, ALT10, ALS10, ACD10, ADI10, AEO10, Sorter, APR10, I&H, Themmo, LDI10, PR BOx, Track, 1/f, LTS20, OPR, KrF Scanner(LTS30), LST20, LTK30, LST10, LTK30, Retide Strocker

MEMS

WT, SHF, NNT20, NSP10, Con, CAB, DRT22, NPE10, 비상샤워기, NEV30, laser anneal, NWS22, NOX10, NLT10, NPL10, NNT10, NWS11, NPE20, NDE20, u/i, NPR10, EPR30, EME20, 현미경, MSM10, CONT, IGZO Sputter 설치 예정 위치, FOUP CLeaner, Slurry 공급, NCM20, EGP10, 세정, NSP20, EME30, NEV20, EOX20, MFP10, Controller, TSP20

FE-SEM

ESE10, 현미경, WT, SHF

CMOS

CAB, SHF, LTS, ERE10, EPR10, WT, EOX10, EME10, MTM40 CAB, TCW10, EDT30, TPE30, DRT21, RFgen, Tube Strocker, DRT32, TPE10, DAL20, TPE50, TCW20, NPE30, NPE40, MTM30, MTM20, DIM10, DRT11, TPE40, TSP10, Cont, DVG10, DLT10, DTE10, DNT10, DPL10, DOX10, DOX20, DOX30, DHT11, DWS11, DWS22, DWS33, 비상샤워기, Wet, AC, C, HF, 안전용, DCM20, DCM10, 신규 WET setup중, SPIKE RTP, DIM21, DNT30, DTE30, DPL30, DIM30, 보호 창구

출구, 입구

A/L, SHSFT, WT, 진공포장기, CAB, AS

1F FAB Layout (Aug. 2023)
2F FAB Layout(Aug. 2023) image
좌측 상단 영역

PC, E-, 칠러, NMF10, Control Rack, LCyer, NMC10, LCyer, dry, PC, 현미경, OVEN, 스핀, WT, NSC10, THC, Wet Bench, NTK20, Curing, WT, Spin Coater, Manual Coater, Wt, 현미, 셀프, Nano Imprint 23년 8월입고, BLG20, NCL30, BLG10, CAB, 시약, NWS3, WT, NCL20, ?, 케미칼보관, S/D, MPF20, WT, THC, NTK70, NTK60, 셀프, OVEN, CAB, 현미경, NWS40, NCL60, WT, NCL10, MTM60, 냉장고, 비상샤워, 보호, PW, 셀프, 보호

좌측 300MM 영역

CAB, Wet CDS, ADO10, Wet CDS, ADN10, 셀프, WT, ADW10(L/D), ATP10, Reclaim(WET), ATM10, PECVD, CAB, 삼성 유휴 SPUTTER(refurb.대기)

좌측 BIO 영역

BPG10, BIO VAC, BSC20, BIC10, BFL10, 셀프, Tube STK, Sorter, BWS20, BCS30, WT, 셀프, CAB, BET10

FAB 후 공정 영역

WT, BLM10, expander, Femtolaser, AS, 셀프, 삼성유휴 8"PE CVD

중앙 영역

셀프, WT, wet station, Dry Etcher(Piezo-electric), NSP30, 셀프, CAB, percvd, NLF20, BEV10, BWS10, NEP30(Cu), NEP30(NiCo), NCP20, CAB, 셀프, NEP20, MPF50, MFP30, EDT40

중앙 센서(IOT) 영역

셀프, 1,2,3,4, 비상계단, 배전반, WT, CAB, BFB30, BFB30, LDI20, BFB10, NOX50, WT, NEV40, BFB20, CONT, 셀프, NLT20, NSP40(AIN SPT), BFB40, PWT10, EPR20, PHV10, 배반, MPF30, 업체(오킨스 wet), 업체, 보호창구, 비상샤워, 입주 기업(템파스), AS, smock room

우측 KAIST 교육용 팹

300mm 장비, FAB 장비, 바이오 장비, 입주기업 장비, IOT 장비, 위쪽에 장비반입로, SHSFT

2F FAB Layout (Aug. 2023)